Please note that some details during SMT chip processing and placement can eliminate adverse conditions, such as misprinting solder paste and removing solder paste from circuit board. Our goal is to deposit an appropriate amount of solder paste at the desired location. Misalignment of dyeing tools, dry solder paste, template and circuit board may produce unwanted solder paste at the bottom of the template or even during assembly.

Common solder paste problems: can you use a small scraper to remove misprinted solder paste from the board? Does this allow solder paste and small solder beads to enter pores and small gaps? For friends who need SMT patch processing service, please contact changkeshun patch processing factory.

Removing solder paste from the wrong printed circuit board with a small scraper can cause problems. It is usually possible to immerse the misprinted board in a compatible solvent (e.g. water containing additives) and then remove small tin beads from the board with a soft brush. I like repeated soaking and washing, not violent dry brushing or shovel. After printing the solder paste, the longer the operator waits to clean the printing error, the more difficult it is to remove the solder paste. After finding the problem, put the misprinted board into the soaking solvent immediately, because the solder paste can be easily removed before drying.

SMT chip processing to prevent solder paste defects

Avoid wiping with cloth strips to prevent solder paste and other pollutants from sticking to the surface of the circuit board. After soaking, brushing with mild spray usually helps remove unnecessary cans. At the same time, SMT patch processing plant also recommends hot air drying. If a horizontal template cleaner is used, the side to be cleaned should face down so that the solder paste falls off the plate. For friends who need SMT patch processing service, please contact changkeshun patch processing factory. Recommended reading: how to maintain PCB proofing?

SMT patch processing to prevent solder paste defects:

During printing, the template is wiped with a specific pattern between printing cycles. Make sure that the template is on the pad, not the welding mask, to ensure that the solder paste printing process is clean. Online and real-time solder paste detection and pre reflow detection after component placement are all process steps to reduce process defects before welding.

For fine pitch templates, if damage occurs between pins due to bending of thin template cross section, solder paste may deposit between pins, resulting in printing defects and / or short circuit. Low viscosity solder paste can also cause printing defects. For friends who need SMT patch processing service, please contact changkeshun patch processing factory. For example, high operating temperature or high blade speed can reduce the viscosity of solder paste during use, resulting in printing defects and bridging due to excessive solder paste deposition.