The world's high-frequency PCB really form a large-scale market in 1999. The United States Institute of interconnecting and packaging electronic circuits (IPC) on the development trend of the world's president Thomas J.Dummrich, who had done this assessment: "1999 is the history of the global PCB industry the most dramatic year, both in the global market structure or in the evolution of technology, are facing an important change." The president referred to the world's PCB on the market structure or technology, an important change in the table is now one of the important aspects of high-speed, high-frequency PCB market is booming and development.
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The development of high frequency copper clad laminate is a long-term and continuous research project. Japan's PCB, recently put forward such a view: in order to adapt to the earth's environment, energy saving and reduce the installation space, data and information processing, high-speed and low power consumption is also endless. Signal transmission is also associated with the transmission of continuous transmission or light generation, etc., high speed and high frequency devices are accelerating, which increases the demand for high frequency PCB." This also requires the CCL industry, the continuous development of the next generation of high frequency copper clad.
The important significance of developing the technology of high frequency copper clad laminate is that the high speed and high frequency PCB is developing continuously, which brings new business opportunities and new application markets to PCB and CCL industry. High speed, high frequency of PCB, from its product design, to choose the substrate material, product production, product testing are everywhere contain new technology, new level. It is also used to enhance the use of a new high-end products.