1: the compound CCL in the punching processing performance, better than the FR-4 type CCL, but higher than the paper-based CCL in the processing of the drill bit wear to high. The cracking process is less than that of paper base copper clad laminate.
2: composite foundation CCL warpage, generally larger than the type CCL FR-4. CEM-1, CEM-3 different quality levels of products, in the degree of warpage and its dispersion has a big difference, in the choice of different manufacturers of these two products, should pay attention to its assessment.
3: with the CEM series of CCL instead of the original production of PCB board used in the FR-4 CCL, to pay attention to the size of its stability assessment.
4: there are manufacturers of composite copper clad laminate products in the glass fiber reinforced plastic and the inner core of the adhesive performance is low. It is particularly reflected in the low heat resistance of welding.
5: China's mainland and Taiwan some CCL manufacturers now produce a lower production cost of a class CEM-1 CCL products. It is mainly composed of phenolic resin, and some of the epoxy resin products. Its appearance is light yellow, it is impossible to achieve the translucent board. It is the performance of the regular CEM-1 CCL in boiled water parallel to layer insulation resistance, resistance to moisture resistance, heat resistance of dip after wet processing performance is slightly lower than that of epoxy resin, the main. Such plates can not pass the requirements of the UL standard infrared spectroscopy (IR) requirements. The price should be lower than the regular CEM-1 products.
Type 6:CEM-1 CCL is easy to absorb moisture, it should pay attention to storage conditions, to prevent the board long time exposed in the humid environment, avoid it due to moisture and solder resistance in the edge of the plate is greatly reduced.